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TVI2303X

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OMDS architecture mainboard



TVI2303X







Descriptions

TVI2303X, OMDS architecture mainboard, uses Intel(R) quad-core, low-power chip set (Cherry Trail Z8350) 2G RAM & 32 G ROM.

Expanding I/O board according to different customer demand, it can be used in mobile POS, Monitoring, Industrial Control and other industries.

TVI2303X

















Features

- Intel AtomTM Cherry Trail Z8350 OMDS, Gen 8 GPU;

- OMDS SODIMM-204pin Interface, High scalability, need to connect carrier board;

- Max 2GB DDR3L & 64GB eMMC onboard;

- Support MIPI-DSI & eDP/HDMI display;

- Support 2 independent displays;

- Support 2.4G/5G Wi-Fi & 3G/LTE connectivity;

- Win10 and Android 4.4/5.1 optional;

- SODIMM contains many rich interfaces: I2S/UART/I2C/USB/OTG/SDIO/GPIO/MIPI

/HDMI/eDP.






TVI2303X


PlatformCPUIntel Cherry Trail T3 Z8350
CoresQuad-core
Frequency1.44~1.84 GHz
MemoryMax. Capacity2 GB(1 GB Optional)
TypeDDR3L
GPUControllerIntel HD Graphics
Frequency200~500 MHz
StorageMax. Capacity32 GB(Up to 64 GB)
TypeeMMC
DisplayMIPI-DSIYes, (connect Carrier board)
eDP/HDMIYes, (connect Carrier board)
Multiple display2 independent displays
CameraMIPI-CSIYes, (connect Carrier board)
ConnectivityWIFI 2.4G/5G, 802.11 b/g/n/ac
BluetoothBT-V4.0 BLE
LTEYes, (connect Carrier board)
GPSN/A
AudioHDAYes, (connect Carrier board)
SensorG-sensorYes, (connect Carrier board)
MonitorWatchdog256-level
OMDS InterfaceSODIMM-204 PinMIPI_CSI2
MIPI_DSI1
HDMI/eDP1
USB OTG1
USB2
I2S1
HSUART/UART-11
UART-2/SPI1
I2C5
A+M+G-sensor1
ALS1
NFC1
SDIO Card1
SDIO WiFi/BT1
GPIO14
Others Sys Ctrl
Power SupplyDC inputDC-in 3.4-5V
EnvironmentOperating Temperature0 ~ 45
Storage Temperature-20 ~ 65
Relative Humidity95%
OSWindowswin10
AndroidN/A
PCBATechnologyODMS
Dimension67.6 * 50 * 3.5 mm
CertificationEMC3C, RoHS


其他产品
OMDS architecture mainboard
OMDS architecture mainboard
OMDS architecture mainboard
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